에스피반도체통신(주)

> 전력반도체 >Discretes > 제품소개
  TO-3PF-3L  

PKG Dimension (W x L x T)   15.500  x 43.800  x 5.500
L/F Pad SIZE (X x Y)           9.000  x 9.000
Pad Thickness (mm)            0.9
Max. Die Size (X x Y)           8.370  x 8.360
Lead Frame (Plate/Gauge)    Bare/Ni/Ag      /     Single Gauge
Lead Thickness (mm)           0.9   
Product Application : MOSFET, BJT
Electrical Performance
 - Current Rating : 3 ~ 90A
 - Voltage Rating : 40 ~ 1,600V
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