에스피반도체통신(주)

> 전력반도체 >Discretes > 제품소개
  TO-3PN-3L  

PKG Dimension (W x L x T) 15.600  x 39.900  x 4.800
L/F Pad SIZE (X x Y)         11.000  x 7.700
                                       12.600  x 7.650  (Large Pad)
Pad Thickness (mm)           1.5
Max. Die Size (X x Y)         10.700  x 7.235
                                        11.940  x 6.840  (Large Pad)
Lead Frame (Plate/Gauge)  Bare/Ni/Ag  /  Dual Gauge
Lead Thickness (mm)         0.6   
Product Application : MOSFET, BJT
Electrical Performance
 - Current Rating : 2 ~ 170A
 - Voltage Rating : 60 ~ 1,200V